Automatic Micro Area Flim Thickness Analyzer EDX 2000A
Description
The EDX 2000A Automatic Micro-area Film Thickness Analyzer is a top-illumination XRF film thickness tester developed by Skyray Instrument. Designed for non-contact micro-area coating thickness testing, it excels in conventional plating analysis as well as demanding applications across the semiconductor, chip, and PCB industries. Featuring an automated 3D movement stage (X, Y, Z-axis), dual laser positioning, and safety controls, it achieves rapid focusing and precise measurement on complex sample geometries including planar, concave-convex, cornered, and arc surfaces.
Key Features & Design Highlights
- Top-Illumination Design: Optimizes testing for special-shaped micro-samples.
- Enhanced Optical Path: Shortened optical passage doubles signal acquisition efficiency compared to traditional setups.
- High-Precision Vision & Focus: Variable-focus high-precision camera combined with a distance correction system supports measurements on micro-products, steps, deep grooves, and countersunk features.
- Automated & Multi-Point Testing: Programmable multi-point detection automates batch testing across multiple samples.
- High-Resolution Detection: Equipped with an imported Fast-SDD detector (140 eV resolution) and high-power X-ray tube/HV unit for stable excitation and reduced fault rates.
- In-Built Calibration: Integrated data correction system maintains consistent measurement accuracy.
Application Fields
- Electroplating Industry
- Semiconductors, Chips, and PCBs
- Precious Metal Electroplating
- Electronic Communication & Electrical Equipment
- Automobile Manufacturing & Aerospace
- Magnetic Materials
- Hardware and Sanitary Ware
- Universities and Research Institutes
Technical Specifications
| Parameter | Specification |
| Measurable range of coating |
3 Li-92 U
|
| Element detection range |
13 AI-92 U
|
| Number of elements to be detected simultaneously |
24 elements, and more than five coatings can be analyzed at the same time
|
| Detection limit |
The thinnest metal coating can reach 0.005µm
|
| Thickness range |
Analysis coating thickness is generally within 50µm (variable for different materials)
|
| Standard deviation of thickness |
RSD < 3%
|
| Content test range |
0.1%-99.99%
|
| Content detection accuracy |
0.5%
|
| Content stability |
The repeatability of multiple measurements can reach 0.5%
|
| Detection time |
5-40 seconds
|
| Lifting range of Z-axis of platform |
0 ~ 140mm
|
| Detector and resolution |
25mm Be window Fast-SDD semiconductor detector with resolution 140 ± 5eV
|
| X-ray device |
50KV/1000uA-W target X-ray tube and imported high-power high-voltage unit
|
| Multichannel analyzer |
DMCA digital multi-channel analysis technology with 4096 channels
|
| Collimator |
Optional 0.1mm, 0.2mm, 0.3mm, 0.5mm and other apertures
|
| Minimum test area |
0.02 mm²
|
| Sample observation |
Equipped with CCD colorful camera, the image can be magnified up to 25 times, which can realize clear positioning of tiny samples.
|
| Sample moving platform |
Full-automatic high-precision multi-point TEST XY mobile platform
|
| Focus |
Laser adjustment of height with variable camera focusing
|
| Analytical method |
Energy Dispersive X-ray Fluorescence Analysis Method combining FP and EC Methods
|
| Security |
Dual safety protection facilities: anti-collision laser detector and sensor detecting sample chamber cover opening and closing; There is no radiation in standby mode, the radiation level during operation is far lower than the international safety standard, and it is equipped with software interlocking device.
|
| Dimensions |
485(W) × 588(D) × 505(H) mm
|
| Sample chamber dimensions |
430(W) × 400(D) × 140(H) mm
|
| Ambient temperature and humidity |
15°C ~ 30°C, ≤70%
|
| Operating power supply |
AC220V ± 5V (it is recommended to configure AC purified regulated power supply)
|
| Instrument weight |
60kg
|