Plating Thickness Analyser » Thick 800A Plating Thickness Analyser
Thick 800A Plating Thickness Analyser
The Thick800A XRF Analyser is designed for rapid and non-destructive analysis of plating layer thickness and compositions of plating and plating solutions. Some features of the Thick 800A include:
Description
Description
- Top lighting for easier measurement of samples of differing thickness.
- Auto-height sample positioning with laser guiding.
- Auto spot search for precise test point alignment.
- Precision positioning sample holder.
- Micro Collimator for improved testing accuracy.
- Point and click by mouse test point determination.
Altitude Transducer.
Si-PIN Semiconductor Detector.
Measurement of up to 5 plating layers.
Micro collimator to improve testing accuracy.
Elements: | Na to U (more than 24 simultaneously). |
Content Range: | 1 ppm – 99.99%. |
Repeatability: | 0.1% |
Long period stability: | 0.1% |
Dimensions: | 648 x 490 x 544 mm |
Sample Chamber: | 517 x 352 x 150 mm |