Thick8000 XRF (Plating Thickness Analyzer)
General InfoThick 8000 Plating Thickness X-Ray Fluorescence Spectrometer is specifically designed plating thickness measurement. Skyray Microspot technology utilises a 3D movable platform, two HD cameras and 8 automatic collimators to achieve precise analysis with spot size as small as 0.1 mm.
The Thick8000 incorporates Skyray’s many years in plating thickness measurement with full-auto software operation, multi-point testing, software controlling the instrument and movable platform.
It is a powerful instrument equipped with special software that is widely applied in plating industries.
|Measurable elements:||Sulfur ( S ) – Uranium ( U )|
|Plating Thickness:||up to 20um|
|Power:||AC 220V ± 5V or AC 110V ± 5V. AC purified voltage power supply|
|Sample chamber size:||52cm x 40cm x 15cm|
|Size:||69cm x 57cm x 66cm|
|Work Temperature:||15℃ -30 ℃|