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Thick8000 XRF (Plating Thickness Analyzer)


General Info
Thick 8000 Plating Thickness X-Ray Fluorescence Spectrometer is specifically designed plating thickness measurement. Skyray Microspot technology utilises a 3D movable platform, two HD cameras and 8 automatic collimators to achieve precise analysis with spot size as small as 0.1 mm.
  • Excellent sample observation system
  • Advanced image identification
  • Built-in SNE (Signal to Noise Enhancer)
  • Intelligent Plating-thickness software
  • Large area high resolution detector
  • Four automatic micro-focus collimators
  • One-click operation

  • Application Fields
  • Metal plating thickness analysis
  • PCB industry
  • Electroplating industry
  • Application Fields

    The Thick8000 incorporates Skyray’s many years in plating thickness measurement with full-auto software operation, multi-point testing, software controlling the instrument and movable platform.

    It is a powerful instrument equipped with special software that is widely applied in plating industries.


    Additional Information

    Measurable elements: Sulfur ( S ) – Uranium ( U )
    Plating Thickness: up to 20um
    Repeatability: 0.1%
    Stability: 0.1%
    Energy Resolution: 135eV
    Power: AC 220V ± 5V or AC 110V ± 5V. AC purified voltage power supply
    Sample chamber size: 52cm x 40cm x 15cm
    Size: 69cm x 57cm x 66cm
    Work Temperature: 15℃ -30 ℃

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