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Plating Thickness Analyser

Plating Thickness Analyser is an instrument that use X-ray fluorescence technology to decide the thickness and composition of plating deposits with extraordinary accuracy. Plating Thickness Analyser measurement is carried out by means of exposing an exactly described place of the take a look at specimen to x-ray energy. We supply the best Plating Thickness Analyser in Malaysia. 

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Thick 800A Plating Thickness Analyzer

Thick8000XRF
(Plating Thickness Analyzer)